Co-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. The technology is also used for a multi-layer packaging for the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.
High temperature Ceramic Substrates means that the sintering temperature is around 1,600 °C (2,910 °F).
In the short term, Japan, United States and Europe will have an unshakable status in HTCC ceramic substrates; China will play an more important role in future, driven by the strong demand from consumer electronics, aerospace & military, automobile electronics and LED market.
Over the next five years, Publisher projects that HTCC Ceramic Substrates will register a 2.6% CAGR in terms of revenue, reach US$ 130 million by 2023, from US$ 110 million in 2017.
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This report presents a comprehensive overview, market shares, and growth opportunities of HTCC Ceramic Substrates market by product type, application, key manufacturers and key regions.
To calculate the market size, Publisher considers value and volume generated from the sales of the following segments:
Segmentation by product type:
Al2O3 HTCC Substrate
AIN HTCC Substrate
Segmentation by application:
Consumer Electronics
Aerospace & Military
Automobile Electronics
LED Market
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The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report:
Kyocera
Maruwa
NGK Spark Plug
SCHOTT Electronic Packaging
NEO Tech
AdTech Ceramics
Ametek
ECRI Microelectronics
SoarTech
Semiconductor Enclosures Inc(SEI)
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Some Points From Table of Content:
1 Scope of the Report
2 Executive Summary
3 Global HTCC Ceramic Substrates by Players
4 HTCC Ceramic Substrates by Regions
5 Americas
6 APAC
7 Europe
Continued…
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