ECOC 2024 will be held in Frankfurt, Germany from September 23 to 25. This year, HYC will showcase some groundbreaking innovations. With the rise of AIGC and large language models fueling unprecedented growth in data processing needs, HYC will present advanced solutions designed to meet these challenges head-on. Highlights include multi-core fiber connectivity for next-gen networks, silicon photonics module connectivity, and AI data center connectivity, to support the massive data transmission and ultra-low latency demands essential for AI data center.
Multi-core Fiber Subassemblies for Next-gen Connectivity
Demand for increased capacity in optical communication networks is growing. The fiber capacity is reaching its limitation due to the Nonlinear Shannon Limit. Multi-core optical fiber with Space Division Multiplexing (SDM) technology is expected to become the best choice to break through the limit. HYC developed a series of Multi-core fiber subassemblies for next-generation connectivity.
- 4CH/7CH/8CH multi-core fiber LC type/FC type fiber optic connector to solve the problem of difficult on-site splicing of MCF connection;
- MCF FIFO(Fan-in & Fan-out) efficiently couples light from single-core fiber (SCF) into each Multi-core fiber (MCF) or the opposite direction;
- MCF Hybrid subassemblies used for future EDFA systems.
Multi-core fibers (MCF) will be widely used in SDM systems, data center interconnects, chip-to-chip communication, next-generation optical amplifiers, quantum communication technologies, and more.
Fiber array with isolator/lens array used for silicon photonics modules
Driven by AI, the continuous iteration from chips to optical modules accelerates toward higher data rates. The demand for 400G and 800G optical modules is experiencing explosive growth, while 1.6T technology is gradually approaching implementation. As a key component for internal connections within optical modules in AI data centers, MT-FA micro-connectivity products ensure high-speed transmission with exceptional quality and stability.
HYC offers a range of high-precision MT and fiber array (FA) products designed for high-speed optical module parallel transmission solutions. The fiber array with an isolator is a crucial subassembly used in 400G/800G silicon photonics modules. The primary process involves attaching the isolator to the FA fiber end face, making the optical path irreversible. With its advanced back-end processing capabilities, HYC ensures excellent product performance, with a return loss exceeding 32dB. The product also meets the reliability standards of GR1221 & 168H PCT, while its shear strength conforms to the MIL-STD-883G standard.
At ECOC 2024, HYC will showcase these new products. Both products highlight HYC's commitment to driving innovation in next-generation connectivity solutions. We invite you to visit HYC at booth D65 to experience these innovations firsthand.