Taiwan Semiconductor Manufacturing Company (TSMC) has launched the N4X manufacturing process this week with the promise of the latest capabilities to high-performance computing (HPC) designs.
N4X Technology
TSMC affirms that the N4X surpasses the N5 by as much as 15% or 4 percent when contrasted with the more powerful N4P at 1.2 voltages. N4X can produce driving voltages greater than 1.2 voltages, and offer improved performance. Customers can benefit from the same design guidelines for N5 to accelerate the development of their N5 process to speed up developing their N4X products. As per TSMC, N4X is planned to start risk production during the initial quarter of 2023.
The features of N4X include:
- Metal stack optimization for the back-end for designs with high-performance performance
• Optimized designs and structure to maximize drive current and frequency requirements.
- Metal-insulator-metal capacitors with a very high density for reliable power supply under demanding performance loads
With its extensive 3DFabricTM advanced packaging technologies and the TSMC Open Innovation Platform(r), TSMC's HPC platform not only provides performance-optimized silicon with N4X technology but also a wide design enablement platform with our ecosystem partners.
What does TSMC Expect from HPC?
This high-performance computing (HPC) products are well-known for their benefits:
Improves the big data computing using the FPGA base
Refuses additional SRAMs to the SoC
Development ease through different architectures
Maximum technology and design flexibility
Obtains greater utilization and greater dynamic power
More memory bandwidth is in line with faster IO connectivity
(TMSC roadmap for process technology)
In the coming few years TSMC anticipates HPC to take over the smartphone industry as the main driver for its growth.
The senior vice-president of business development at TSMC, Kevin Zhang, said that the HPC product line is the fastest-growing segment of the company and they consider it an honor to launch N4X since it's the first time that a fusion has occurred with its X' lineage of high-performance semi technologies.
N4X will be able to meet the increasing demand for computing when HPC devices reach their maximum size of reticle According to Yujun Li, TSMC's head of HPC business development.
Technologies for processing that support HPC are expected to grow until 2022, according to the report.
The largest Apple supplier has recently received the approval of Taiwan's Investment Commission of the Ministry of Economic Affairs for setting up an Apple wafer production plant in Japan that will work with SONY.