Introduced in 2018, ZiP (zGlue Integration Platform) chip-stacking technology aims to produce chips similar to Systems-in-Package (SiP) but at much lower costs and lead times.
We first found it in a Bluetooth tracker featuring ZGLZ1BA custom chip manufactured with zGlue technology and integrating an Arm Cortex-M0 MCU, flash memory and sensors into a single package. But now the technology is back in the news with Antmicro announcing GEM chiplet-based ASIC last December.
At the time of the announced the company's GEM1 chip featured two Lattice iCE40 FPGAs with a MIPI CSI-2 switch, and they had started working on GEM2